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Qu'est-ce (qui) est L pad - définition
L pad
ANALOG SWITCHING ELEMENT
L-pad
An L pad is a network composed of two impedances that typically resemble the letter capital "L" when drawn on a schematic. It is commonly used for attenuation and for impedance matching.
D-pad
![Famicom]] controller. The D-pad (cross shape on left) first came to prominence on the controller for the Famicom.](https://commons.wikimedia.org/wiki/Special:FilePath/Nintendo-Famicom-Controller-I-FL.jpg?width=200 "Famicom]] controller. The D-pad (cross shape on left) first came to prominence on the controller for the Famicom.")
![[[Sega Master System]] D-pad providing eight-directional buttons](https://commons.wikimedia.org/wiki/Special:FilePath/Sega master system d-pad.jpg?width=200 "[[Sega Master System]] D-pad providing eight-directional buttons")
FLAT, USUALLY THUMB-OPERATED DIRECTIONAL CONTROL ON MOST MODERN VIDEO GAME CONTROLLERS AND REMOTE CONTROLLERS
Control pad; D-Pad; Directional pad; Digital Pad; Dpad; D pad; D-pads; Digital pad
A D-pad (short for directional pad or digital pad; officially referred to by Nintendo as a +Control Pad) is a flat, usually thumb-operated, often digital, four-way directional control with one button on each point, found on nearly all modern video game console gamepads, game controllers, on the remote control units of some television and DVD players, and smart phones. Like early video game joysticks, the vast majority of D-pads are digital; in other words, only the directions provided on the D-pad buttons can be used, with no intermediate values.
Thermally conductive pad
THERMAL INTERFACE MATERIAL IN THE FORM OF A SOFT PAD, USED IN COMPUTING
Thermal pad (computing)
In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper). Thermal pads and thermal compound are used to fill air gaps caused by imperfectly flat or smooth surfaces which should be in thermal contact;AMD - Thermal Interface Material Comparison: Thermal Pads vs.
